
Started process "Map".

Using target part "2s50pq208-6".
Removing unused or disabled logic...
Running cover...
Running directed packing...
Running delay-based LUT packing...
Running related packing...
ERROR:Pack:12 - The RLOC value of R24C0.S1 on component test2_pid_top_s_x_2(10)
   in RPM test2_pid_top_addsub4_core_instance6/hset creates a macro that is too
   large for the device.  Use a bigger device.
ERROR:Pack:12 - The RLOC value of R24C0.S1 on component test2_pid_top_s_x_3(10)
   in RPM test2_pid_top_addsub5_core_instance8/hset creates a macro that is too
   large for the device.  Use a bigger device.
ERROR:Pack:12 - The RLOC value of R16C0.S1 on component test2_pid_top_s(4) in
   RPM test2_pid_top_addsub1_core_instance0/hset creates a macro that is too
   large for the device.  Use a bigger device.
ERROR:Pack:12 - The RLOC value of R16C0.S1 on component test2_pid_top_s_x_0(4)
   in RPM test2_pid_top_addsub2_core_instance2/hset creates a macro that is too
   large for the device.  Use a bigger device.
Problem encountered generating the NCD.

Mapping completed.
See MAP report file "test2_pid_clk_wrapper_map.mrp" for details.
Problem encountered during the packing phase.

Design Summary
--------------
Number of errors   :   4
Number of warnings :   0
ERROR: MAP failed
Process "Map" did not complete.

Mapping Module test2_pid_clk_wrapper . . .
MAP command line:
map -intstyle ise -p xc2s50-pq208-6 -cm area -pr b -k 4 -c 100 -tx off -o test2_pid_clk_wrapper_map.ncd test2_pid_clk_wrapper.ngd test2_pid_clk_wrapper.pcf
Mapping Module test2_pid_clk_wrapper: failed

